ºñÁî´Ï½º 778

ACO

AMETEK

APPLIED MEMBRANES

AMITTARI

ARCOTEST

BALMAC INC

BECKMAN COULTER

BJORNAX AB

BW TECHNOLOGIES

CHEM INSTRUMENT

DAKOTA ULTRASONICS

DCS INC

DEFELSKO

DIAVITE AG

NIPPON DENSHOKU

ECOPIA

EGG TESTER

ELCONTROL ENERGY

EIT INC

ETS-LINDGREN

FOURIER SYSTEM LTD

FOURTEC

GALLTEC + MELA

GE SENSING

GRANT INSTRUMENTS

HYDRONIX

IET (IDENSHI)

IKM INSTRUTEK

IMV CORPORATION

INSTRUTECH INC

ION SCIENCE

JFE ADVANTECH

KELLER

LIST-MAGNETIK

METONE

MICRONICS LTD

MIKRON

MTI INSTRUMENT INC

NITTOSEIKO ANALYTECH

OKANO WORKS

ONO SOKKI

PCWI

PINION PRODUCTS CORP

RALSTON INSTRUMENTS

RM YOUNG

SCANSENSE

SHAW MOISTURE METER

SHOTOX

SHOWASOKKI CO LTD

SHINYEI KAISNA

STRESSTEL

TESTO

TRAFAG

TREK INC

UE SYSTEM

ULVAC

WILDCO

ZAWADA NDT

OTHER MAKER

 
Semiconductor Metrology Systems ¢¹ Semiconductor Metrology Systems
Semiconductor Metrology Systems
  ¸ðµ¨¸í : Proforma 200SA
  ¿ø»êÁö : ¹Ì±¹
  Á¦Á¶»ç : MTI INSTRUMENT INC
  °¡   °Ý : ¹®ÀÇ(031-753-9550)
  ºÐ·ù¸í : Semiconductor Metrology Systems
product
Á¦Ç°»ç¾ç
Àû¿ë»ç·Ê
±â¼úÀÚ·á
 

 

Semiconductor Metrology Systems

PROFORMA SERIES

Semi-Automated Wafer Measurement System for Semiconducting and Semi-Insulating Material

The Proforma 200SA is a semi-automated thickness measurement system for both semiconducting and semi-insulating wafer materials. Capable of handling 75 to 200 mm. wafers, the 200SA provides highly accurate, repeatable measurements of thickness, TTV, bow, warp, site and global flatness. Built around MTI Instruments' exclusive Push-Pull capacitance technology, the Proforma 200SA delivers full wafer surface scanning at the press of a button. User defined and ASTM/SEMI scan patterns are used to generate a full 3-dimensional image of the wafer.

Easy to Use....

The standard Windows¢ç user interface makes the Proforma 200SA easy to use and set-up. Each measurement and machine parameter is selectable from a list of standard options. The control software has three levels of security, from a production environment to a full engineering analysis of wafer geometry. Customized data reports, as well as the ability to export measurement data to any spreadsheet add the ability to match the Proforma 200SA to your process needs.

Wafer Specifications

  • Diameter: 75 mm, 100 mm, 125 mm, 150 mm, 200 mm.
  • Material: All Semiconducting and Semi-insulating including Si, GaAs, InP Ge, SiC.
  • Surfaces: As-cut, Lapped, Etched, Polished, Patterned.
  • Flat/Notch: All SEMI Standard Flat(s) or Notch.
  • Conductivity: P or N Type.
  • Wafer mounting: Bare Wafer, Sapphire/Quartz Base, Tape.

Measurements

  • Thickness and TTV.
  • Bow.
  • Warp.
  • Site and Global Flatness

Advantages

  • Measures Different Materials such as, Si, Ge, GaAs, InP.
  • Full 1000 uM Thickness Measurement Range without re-calibration. Extended range models available for thickness range to 1.7 mm.
  • Standard Windows¢ç User Interface.

 

  • MTI Instruments' exclusive Capacitance Circuitry for Outstanding Accuracy and Repeatability.
  • 75 to 200 mm. Wafers.
  • ASTM/SEMI Standard Measurements.

 

  • Slicing
    • Saw set-up
      • Thickness
      • TTV
    • Degradation monitoring
      • Wire guide re-grooving
      • Blade replacement
  • Lap/etch and polishing
    • Process monitoring
    • Thickness
    • TTV
    • Material removal
    • Bow
    • Warp
    • Flatness
  • Backgrind
    • Removal rate
  • Final Inspection
    • Lot sampling
    • Final thickness