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Semiconductor Metrology Systems ¢¹ Semiconductor Metrology Systems
Semiconductor Metrology Systems
  ¸ðµ¨¸í : Proforma 300
  ¿ø»êÁö : ¹Ì±¹
  Á¦Á¶»ç : MTI INSTRUMENT INC
  °¡   °Ý : ¹®ÀÇ(031-753-9550)
  ºÐ·ù¸í : Semiconductor Metrology Systems
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Semiconductor Metrology Systems

Proforma 300

The ProformaTM 300 Advantage... One Package for ALL Wafer Sizes and Materials

Based on MTI Instruments' proprietary capacitance technology, the Proforma 300 can be used on all wafer materials including:

  • Silicon
  • Gallium-Arsenide
  • Indium Phosphide
  • Germanium
... without recalibrating or electrically grounding the wafer!

Fast, Accurate, and Reliable, the Proforma 300 measures wafers up to 300 mm in diameter for both thickness and total thickness variation (TTV)

Portable and Easy to Set Up, the Proforma 300 provides the user precise non-contact measurements at critical points throughout the wafer manufacturing process.

Thickness and TTV values are obtained by placing the wafer between MTI Instruments' non-contact capacitance probes. The Teflon coated wafer stage allows for easy, non-abrasive positioning of the wafer, while removable locating pins can be utilized for precise center thickness measurements. Thickness and TTV values are indicated on the high resolution LCD display.

An RS-232 port is provided for output to a personal computer, while a parallel port provides direct output to a printer.

The Proforma 300 is completely menu-driven. The on-board intelligence provides fast, accurate, repeatable measurements for all types of wafer materials. Maximum measurement range or maximum probe/wafer stand-off distance can also be adjusted to meet your specific requirements.

  • Menu-driven for Fast, Easy Setup.
  • Proprietary Push-PullTM Probe Technology.
  • High-resolution LCD Display.
  • On-board Microprocessor for Accurate, Repeatable Measurements.
  • Bubble Level.
  • Adjustable Stage for Precise Leveling.
  • Teflon Wafer Stage for Easy, Non-abrasive Positioning.

Measurements

  • Thickness.
  • Total Thickness Variation (TTV).
  • Bow
  • Continuous and 5-point Measurement.

Advantages

  • Measures Different Materials, such as Si, Ge, InP, and GaAs, Without Recalibration.
  • No Need to Electrically Ground the Wafer.
  • Easy to Set up and Operate - making it ideal for and Statistical Process Control (SPC).
  • Provides High Performance at Low Cost.
  • Can be Customized for Maximum Sensing Range or Maximum Stand-off from Target.

 

  • MTI Instruments' Proprietary Capacitance Circuitry for Outstanding Accuracy and Dependability.
  • Non-contact Measurements.
  • 50-300 mm Diameter Wafer Range.
  • +/-0.25 µm Accuracy.
  • RS-232 Output Port to PC.
  • Parallel Port for Printer.

 

  • Slicing
    • Saw set-up
      • Thickness
      • TTV
    • Degradation monitoring
      • Wire guide re-grooving
      • Blade replacement
  • Lap/etch and polishing
    • Process monitoring
    • Thickness
    • TTV
    • Material removal
  • Backgrind
    • Removal rate
  • Final Inspection
    • Lot sampling
    • Final thickness